OMI building blocks and developments for future high performance processing systems in the aerospace and automotive fields: DSP, SMCS and VIRTUOSO

摘要

The DIPSAP-II (ESPRIT/OMI 8068) project is both a technology provider and technology user project concentrating on high performance processing applications based on Digital Signal Processors. The three main enabling technology elements of the DIPSAP-II project are the Digital Signal Processor (DSP), Scalable Multi-channel Communications Subsystem (SMCS), and the Software Environment (VIRTUOSO). The DSP is based on the existing ADSP-21020 and will be produced as chip (TSC21020E) for the space market, as OMI macrocell core (VHDL model) and as DSP/ASIC (integrated system-on-chip for the automotive market) demonstrator. The SMCS is a communication chip providing the interface between the processor (e.g. DSP) bus and the IEEE 1355 based serial links used to build multi-processor systems. Extensions to the Virtuoso Classico and Synchro software environment to support these technologies are being realised. In the project, the above enabling technologies will be integrated and demonstrated for candidate applications in the space and automotive fields.