Enhanced PBGA-the next generation

摘要

This paper describes LSI Logic's new generation of Enhanced Plastic Ball Grid Array (EPBGA) package designs. The first generation was developed and implemented into production. As its popularity grew, new performance requirements emerged. The second generation was designed with enhancements to meet these new requirements. This paper describes the first generation to give the reader sufficient background information, and proceeds to discuss the enhancements of the second generation, including their implementation, and their effect on the manufacturability and reliability of the package family.