In the field of the IC packaging, almost every device assembled in the molding process with a thermosetting resin formed into a tablet. The trend for down sizing and integration of the IC devices brings the molding process into the clean room, and demands the package itself to be without failures like void, unfilling and so on. However the current molding tablets are made of powder resin compound by punching, so that they generate the dust and sometimes have been cracked during the transportation and storage. With the above circumstances, we have innovated a new production process of the molding tablets, Clean Tablet. Key technologies in this development are precise control of reacting conversion of the compound as well as weight, dimension and compression ratio of the tablet. Finally we have developed a new machine that is composed of feeder, kneader and tablet former mutually connected and controlled. This new machine can make almost all kinds of compound and sizes of the mold compounds currently available for Multi-Plunger Transfer Molding System. The newly developed Clean Tablet has following features. (1) Extremely high density, up to 98-100%, compared to 96% max of the conventional type. (2) no dust and less cracking. (3) Yield loss of the package due to voids and pinholes generated by air and volatility in the tablets is extremely low.
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