A new acrylated urethane encapsulant has been formulated for use on ceramic chip carriers. This encapsulant has been implemented on pin grid array (PGA) ceramic carriers and on peripheral leaded surface mount (SMT) ceramic carriers for IBM's C4 chips. The encapsulant is a UV curable material and is used to cover the thin film circuitry on the ceramic carrier. The encapsulant offers a low cost alternative to the metal caps that were used on the pin grid array ceramic carriers or to the ceramic cap that was used on the peripheral leaded surface mount carrier. UV curing was chosen as the preferred curing process in order to improve the manufacturing process flow.
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