An automated integrated circuit (IC) wire-bond inspection system has been successfully developed. The system is capable of measuring the height and diameter of the bonds. The bond height is detected by automatically computing the focused planes of the top and the base of the bond with a series of two-dimensional images of the bond. The focused plane of an image is obtained by extracting the high-frequency features of the image. By scanning horizontally and vertically for a steep change in gray level of the image, the diameter of the bond is calculated. The system carries out the measurement task at a speed of six bonds per minute. Precision of /spl plusmn/0.9 /spl mu/m and /spl plusmn/2.0 /spl mu/m for the height and diameter measurement can be obtained.
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机译：自动化集成电路（IC）焊线检查系统已经成功开发。该系统能够测量键的高度和直径。通过自动计算键的顶部和底部的聚焦平面以及一系列键的二维图像，可以检测键的高度。通过提取图像的高频特征来获得图像的聚焦平面。通过水平和垂直扫描图像灰度的陡峭变化，可以计算出键的直径。系统以每分钟六键的速度执行测量任务。对于高度和直径测量，可以获得/ spl plusmn / 0.9 / spl mu / m和/ spl plusmn / 2.0 / spl mu / m的精度。
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