首页> 外文会议>Electronic Components and Technology Conference, 1992. Proceedings., 42nd >Percolation constraints in the use of conductor-filled polymers for interconnects
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Percolation constraints in the use of conductor-filled polymers for interconnects

机译:使用导体填充的聚合物进行互连时的渗透限制

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The properties of composite systems are understood in terms of percolation phenomena; when a sufficient amount of conductive filler is loaded into an insulating polymer matrix, the composite transforms from an insulator to a conductor, the result of continuous linkages of filler particles. The critical volume fraction at which this transformation occurs, V/sub c/, is the focus of the investigation reported. The concentration is on the properties of some silver-filled silicon rubber composites, and it is shown how the artificial percolation restrictions affect both the critical volume fraction and the resistivity of the composite. A computer simulation of the two-dimensional case shows that these restrictions affect V/sub c/ in a predictable manner. An empirical method of predicting V/sub c/ for non-restricted systems is presented.
机译:可以从渗滤现象来理解复合系统的特性。当将足够量的导电填料填充到绝缘聚合物基体中时,复合材料会从绝缘体转变为导体,这是填料颗粒连续连接的结果。发生这种转变的临界体积分数V / sub c /是所报道研究的重点。该浓度取决于某些填充银的硅橡胶复合材料的性能,并表明了人工渗滤限制如何影响复合材料的临界体积分数和电阻率。二维情况的计算机模拟显示,这些限制以可预测的方式影响V / sub c /。提出了一种预测非受限系统V / sub c /的经验方法。

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