VLSI packaging requirements for new and evolving work stations

摘要

It is suggested that there are four technological improvements that workstation designers need for future systems: (1) area pad connections to die; (2) low thermal resistance from junction to air; (3) reliable, inexpensive MCMs (multichip modules); and (4) 'known good' bare die to put on the MCMs. Having area pad connections to the die accomplishes two critical things: it provides the number of pins that the system architects want, and drives the die attach technology towards low series inductance. The low thermal resistance permits the system designer to survive the air flow constraint that has been placed on the box by acoustic noise limits and very tight mechanical packaging. MCMs enable the designer to confine high speed paths to the module. This eases the problems of crosstalk and skew that the current generation of single device packages aggravates.