Area array demountable tape automated bonding (DTAB), a novel demountable, high-performance TAB package, is discussed. Special features of this package, its advantages compared to pin grid arrays (PGA), and its performance characteristics are presented. The basic concept for the package is introduced, and the advantages of this package in the manufacturing of printed circuit assemblies are discussed. Also the design of the package from the design for manufacturability point of view is explained.
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