A study of electrical performance for next generation plastic packages

摘要

The authors compare the power and ground path inductance for three types of plastic packages. These packages are the 196 S/L PQFP (single-layer plastic quad flat pack), the 296 FR-PQFP (fine-pitch PQFP), and the 196 MM-PQFP (multilayer molded PQFP with one power and one ground plane). The S/L PQFP and the MM-PQFP packages are wirebonded and the FP-PQFP package is TAB (tape automated bonding) bonded. The authors also present plots of lead inductance as a function of the number of leads for the three packages and MM-PQFP plane inductance as a function of the number of leads. Simulations show that the MM-PQFP has the lowest power and ground path inductance while the S/L PQFP has the highest.