In this paper, we propose a method of simulating to determine the initial height necessary for the well movement of the electronic wire bonder. For some bonding places, optimal initial heights there in order to go to next bonding places are obtained experimentally and know them, a methematioal model, as a surface function defined by the initial heights, was built. The initially raising position of the electronic wire bonder can be controlled by computer program, and can make the movement of bonder become fullautomatic. As the result, the well-arranged wiring and reliable contacting were obtained.
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