Improving the circuit pack manufacturing yield by the methods of analyzing the circuit pack repair data

摘要

A large share of electronic system manufacturing cost is related to the process of assembly, diagnosis, and circuit board repair. To enhance the circuit pack diagnosis accuracy and efficiency, and the yield of product, two analysis methods based on the repair data collected by a computer-integrated manufacturing system have been devised. One is test program evaluation, and the other is detailed circuit pack failure mode analysis. The main purpose is to reduce the total cost of product and enhance the quality. Currently, tools for analyzing test programs and detailed FMA for circuit codes have been installed in four AT&T manufacturing locations and interfaced with other AT&T internal software systems.