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Verification of thermal analysis of PWBs for RAMCAD

机译:验证RAMCAD的PWB的热分析

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Methods involving approximate numerical solutions of the energy equations in two dimensions were developed to allow thermal management and tradeoffs to be conducted efficiently. A validation of the approximate theoretical predictions compared favorably with the experimental data using infrared thermography. Experimental data indicate that infrared thermography provides a method of measuring the temperatures of powered PWBs (printed wiring boards). The overall difference between the measured temperature profile and the calculated temperature profile is within 10%. The discrepancies are thought to be due to uncertainties in material properties and the experimental methods.
机译:开发了涉及二维能量方程的近似数值解的方法,以允许有效地进行热管理和权衡。近似理论预测的验证与使用红外热成像的实验数据相比具有优势。实验数据表明,红外热成像技术提供了一种测量有源PWB(印刷线路板)温度的方法。测得的温度曲线与计算的温度曲线之间的总体差异在10%以内。这种差异被认为是由于材料性能和实验方法的不确定性造成的。

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