mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications

摘要

In this paper, the 2 by 2 mmWave AiP array is design in organic substrate using fcCSP structure. The RF die is placed on bottom side of organic substrate and the AiP array is designed in the front side of organic substrate. Through 3D electromagnetic solver, the single AiP has good bandwidth with over 6 dBi antenna gain. In design stage, the spherical chamber is utilized to validate single antenna performance with a package level testing. It can directly measure by RF prober on C4 bump pad or micro bump pad to get 2D or 3D radiation pattern of single antenna. From the simulation and measurement results, there is a good correlation to obtain the quality of manufacturing. In engineering stage, the RF die is mounted on the bottom of organic substrate. The AiP device that its function can be tested by compact antenna test range (CATR) chamber to get all relative radiation patterns, such as 2D/3D pattern and EIRP with RF die performance. Of course, the CATR is a good validation solution for beamforming measurement. Finally, for mass production, a measurement test set is announced for mmWave AiP or SiP production test. Through the different measurement solutions and mmWave measurement flow, a completed mmWave AiP and SiP flow from design to validation is delivered.