Integrated magnetic cores in FOWLP and their applications

摘要

This paper demonstrates that fan-out wafer-level packaging (FOWLP) can enable high-Q integrated passive devices (IPDs) on low-loss mold compound materials. Moreover, we show that thick ferrite cores can be embedded into FOWLP, further enhancing the RF performance to meet the requirements of power applications. The obtained IPD performance indicates that this approach can lead to a cost-effective packaging solution for the overall product offering.