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NEXT GENERATION PURIFICATION METHOD FOR ACHIEVING LOW TRACE METALS IN ULTRA-HIGH PURITY CHEMICALS

机译:用于在超高纯度化学物质中实现低痕量金属的下一代纯化方法

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The high purity requirements of materials used in semiconductor manufacturing are being pushed to unprecedented levels as demand for reliability in computer processors over increasingly longer lifetimes continues to rise. The production of these high purity chemicals requires new purification methods and technologies. One of the limiting factors in purification process is to bring the metal impurities into close contact with purifying surfaces. Current metal reduction techniques rely on ion exchange technology however, the pathways are large in comparison with the size of the unwanted metal species. A new approach is required to increase the probability of contact between the metal species with the exchange surface. In addition, fluid channels need to be mixed, rotated, and inverted in order to increase the probability of surface contact. The new approach discussed in this paper would present a method for dividing the fluid through micro-channels that form tortuous pathways. These micro-channels allow for further dividing and converging of the fluid thereby presenting the metal species to the purifying surfaces throughout the porous matrix. Several high purity chemicals such as PGMEA used in microelectronic industries were purified using the above approach. The metal concentrations of low parts per billion (ppb) were effectively reduced to low parts per trillion (ppt). The ion exchange capability was a function of the concentration and the presence of the species in the solution. Two ion exchange chemistries of strong acid and chelating were made into these structures and their purification performances were assessed and compared in terms of removal efficiencies. Furthermore, these two chemistries were evaluated in series to demonstrate the overall synergistic purification capabilities.
机译:随着对计算机处理器可靠性的需求在越来越长的寿命继续上升时,半导体制造中使用的材料的高纯度要求被推到前所未有的水平。这些高纯度化学品的生产需要新的净化方法和技术。净化过程中的一个限制因素是将金属杂质与净化表面紧密接触。然而,目前的金属还原技术依赖于离子交换技术,与不需要的金属物种的大小相比,途径很大。需要一种新的方法来增加金属物种与交换表面之间接触的概率。另外,需要混合,旋转和倒置流体通道以增加表面接触的概率。本文讨论的新方法将介绍一种将流体通过形成曲折途径的微通道分割的方法。这些微通道允许进一步分割和会聚流体,从而将金属物质呈现给整个多孔基质的净化表面。使用上述方法纯化了几种高纯度化学品,例如微电子行业的PGMEA。每十亿(PPB)的金属浓度有效地减少到每万亿(PPT)的低部位。离子交换能力是溶液中浓度的函数和溶液中物种的存在。在这些结构中制备了两种离子交换化学和螯合剂,并在去除效率方面进行评估和比较它们的纯化性能。此外,串联评估这两个化学物质以证明整体协同纯化能力。

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