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Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems

机译:压力传感:一种新型方法,用于在气相焊接系统中的处理区

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Vapour Phase Soldering (VPS) [1] has become a significant alternative method for reflow soldering in the last years [2–3]. Since the technology is based on heat transfer principles, which are totally different from the conventional reflow technologies (forced convection or IR), a new approach is needed for the characterization of the processing zone inside the vapour chamber. This paper presents the results of a novel method for characterization: the measurement of pressure differences in the processing zone of a VPS tank. For this purpose, high resolution pressure sensors were applied to a batch type, experimental VPS station. High resolution of the measurement range is a key factor of the method due to the small pressure differences of the process. The measurements correlate to the Galden vapour density and the temperature, which are also important aspects of the experiment.
机译:气相焊接(VPS)[1]已成为过去几年回流焊接的重要替代方法[2-3]。由于该技术基于传热原理,其与传统的回流技术(强制对流或IR)完全不同,因此需要一种新的方法来表征蒸汽室内的处理区。本文介绍了一种表征新方法的结果:VPS罐的处理区中压力差的测量。为此目的,高分辨率压力传感器应用于批量型,实验VPS站。测量范围的高分辨率是由于该过程的压力差异的小的压力差异是该方法的关键因素。测量与GALDEN蒸汽密度和温度相关,这也是实验的重要方面。

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