首页> 外文会议>Conference on ultrafast phenomena and nanophotonics >Zero-valent Au, Cu and Sn Intercalation into GeS Nanoribbons: Tailoring Ultrafast Photoconductive Response
【24h】

Zero-valent Au, Cu and Sn Intercalation into GeS Nanoribbons: Tailoring Ultrafast Photoconductive Response

机译:零价金,铜和锡插入GeS纳米带中:量身定制超快光电导响应

获取原文

摘要

Germanium sulfide (GeS) is a 2D semiconductor with high carrier mobility and a moderate band gap (~1.5 eV for multilayer crystals), which holds promise for high-speed optoelectronics and energy conversion. Here, we use time-resolved THz spectroscopy to investigate how intercalation of Au, Cu, and Sn impacts the photoexcited carrier dynamics and transient photoconductivity of GeS nanoribbons. We find that zero-valent metals affect the photoexcited carrier lifetime and mobility in different ways. Intercalation of GeS with Cu reduces the lifetime of carriers from ~ 120 ps to 60 ps, while Au and Sn intercalation do not. At the same time, intercalation with Cu, Sn and Au significantly enhances the scattering time of photoexcited carriers (~120 fs vs ~65 fs without intercalation), highlighting the potential of zero-valent metal intercalation as a tool for engineering the optoelectronic properties of GeS nanostructures for application in high-speed electronic devices.
机译:硫化锗(GeS)是一种2D半导体,具有高载流子迁移率和适度的带隙(多层晶体约为1.5 eV),为高速光电和能量转换提供了希望。在这里,我们使用时间分辨的THz光谱来研究Au,Cu和Sn的嵌入如何影响GeS纳米带的光激发载流子动力学和瞬态光电导性。我们发现零价金属以不同方式影响光激发载流子的寿命和迁移率。 GeS与Cu的嵌入使载流子的寿命从〜120 ps降低到60 ps,而Au和Sn的嵌入却没有。同时,与Cu,Sn和Au的插层显着增加了光激发载流子的散射时间(〜120 fs与〜65 fs,而没有插层),突显了零价金属插层作为一种工程设计光电特性的潜力。用于高速电子设备的GeS纳米结构。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号