Advances in G-Stack Diode Laser Using Macro-Channel Water Cooling and High Thermal Conductivity Material Packaging

摘要

There are strong demands at the market to increase power and reliability for high power diode laser. In parallel to this the requirements for cooler and package for the high power diode laser increase. Superior heat dissipation capability and low thermal resistance are some of the key attributes for the diode laser package design in the near future. The most common method of removing the large amounts of waste heat in a diode laser is using a micro-channel cooler. However, a micro-channel cooler requires water to meet demanding specifications to avoid failures due to corrosion, which increases the overall cost to operate and maintain the laser. We demonstrate advances in a new macro-channel water cooling diode laser which are designed to eliminate the failure mechanisms associated with micro-channel coolers, and enhance the laser heat dissipation and the long-term reliability. For the package adopting the high thermal conductivity material, the maximum output power is 100 W per bar in CW mode. Due to the advantage of compact design, high power, high reliability and fast axis collimation, the new diode laser has the potential to be widely used in many fields, such as pumping solid state laser, hair removal, industry and research.