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Research on high-speed transmission characteristics of the BGA ceramic substrate employed in multi-channel optical transmitter module

机译:多通道光发射机模块中BGA陶瓷基板的高速传输特性研究

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In this paper, the high-speed electrical transmission characteristics of the ceramic substrate employed in multi-channel optical transmitter module and the factors that affect its electrical characteristics encompassing equivalent model of BGA balls below ceramic substrate, roughness of metal material-Au, width tolerances of transmission lines on surface of ceramic substrate and length of bonding wire between modulator and driver chips were analyzed and studied. According to the inconformity between simulation and test results, an optimized simulation model was proposed and verified to estimate test high-speed performance of the ceramic substrate better. The 3-dB bandwidth of transmission lines on the ceramic substrate is nearly 35GHz which demonstrates that the optical transmitter module based on the ceramic substrate has great potential to support successfully transmission exceeding 25 Gb/s.
机译:本文研究了多通道光发射机模块中使用的陶瓷基板的高速电传输特性以及影响其电特性的因素,包括陶瓷基板下方的BGA球的等效模型,金属材料的粗糙度-Au,宽度公差分析并研究了陶瓷基板表面传输线的分布以及调制器和驱动器芯片之间的键合线长度。根据仿真结果与测试结果的不一致性,提出并优化了仿真模型,以更好地估计陶瓷基板的测试高速性能。陶瓷基板上传输线的3 dB带宽接近35 GHz,这表明基于陶瓷基板的光发射器模块具有巨大的潜力,可以成功支持超过25 Gb / s的传输。

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