Research on Thermal Performance of Single Chip Based on SiP Technology

摘要

The research shows that the life failure rate of the device will be doubled when the temperature of the electronic device increases by 10°C, so it is very important to study the function of packaging thermal management in the electronic device. In this paper, the SiP design of a single chip is carried out by cadence software, and the thermal simulation analysis is carried out. The results show that the maximum junction temperature of a single chip is 57.4°C, and the package thermal resistance is 32.4°C/W. Compared with without heat sink, the junction temperature and thermal resistance of the chip are reduced by 10.6% and 17.3% respectively.