The Analysis of the Structural Dynamic Characteristics in Board Packaging Structure and Its Test Technology Research

摘要

In the mechanical environment, the most likely mechanical elements of electronic equipment’s failure are the leads and solder joints of electronic equipment. Because in electronic packaging products, the numbers of leads and solder joints is large and the volume is small, with large scale and large cross domain to electronic board, it is unwise to set a unified model. This paper puts forward a crossed scale modeling method and a model modification method based on parameter sensitivity analysis. At last the fine modeling of the span from 0.05mm rubber thickness to 100mm plate radius is realized by many equivalent modeling technologies, which are fine modeling of solid elements being adopted for the key parts such as solder joints and leads, using shell element equivalent to circuit board, at the same time, setting a transition mesh in the connection area of the shell cell, and the connection between shell element and body element realized by using body shell element degree of freedom matching technology, local grid refinement technology and the matching technology of the degree of freedom of body shell element. Finally, the modal test is carried out by the optical modal test technology, and the simulation model is modified. The methods proposed in this paper have good engineering application value and can be used to analyze the stress level of solder joints and leads of packaging devices under vibration and impact environment.