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Evolution of High Strain Rate Mechanical Properties of SAC-R with High Temperature Storage at 50°C with High and Low Operating-Temperatures

机译:高温和低工作温度下在50°C高温储存的SAC-R高应变速率机械性能的演变

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Previous published literature on material constitutive behavior for SAC-R lead-free solder alloys is restricted to either low strain-rates or room temperature storage (25°C). For the material (SAC-R), high strain-rate data is not available for the storage at high or low operating temperatures. In this experiment, SAC-R has been tested and analyzed at various surrounding temperatures starting from 25°C up to 200°C, with high strain-rates and high aging-temperature as well as low surrounding temperatures from 0°C to -65°C. Storage times of 30-days and 60 days have been studies for a storage temperature of 50°C. Multiple replicates have been tested at each of the conditions and averaged curves reported in the paper. Stress-strain curves have been plotted for a wide range of strain rates and operating temperatures for pristine specimen to aged specimen which have been made using reflow profiles representative of solder-joint production assemblies. The experimental data has been fit into the Anand Viscoplasticity model for (SAC-R) and the Anand constants have been computed by forecasting the measured stress-strain behavior for large ranges of operating temperatures and strain rates. Predictions are compared with the experimentally measured values.
机译:以前发表的有关SAC-R无铅焊料合金的材料本构行为的文献仅限于低应变率或室温存储(25°C)。对于材料(SAC-R),在较高或较低的工作温度下都无法存储高应变率数据。在此实验中,已对SAC-R进行了测试,并在从25°C到200°C的各种环境温度下进行了测试和分析,具有较高的应变率和较高的老化温度以及从0°C至-65的较低环境温度℃。对于50℃的储存温度,已经研究了30天和60天的储存时间。已在每种条件下测试了多个重复样品,并报告了报告中的平均曲线。原始应变片到老化样本的应力-应变曲线针对较宽的应变率和工作温度进行了绘制,这些温度和应变温度是使用代表焊点生产组件的回流曲线制成的。实验数据已拟合到(SAC-R)的Anand粘塑性模型中,并且Anand常数是通过预测大范围的工作温度和应变速率下测得的应力-应变行为而计算出的。将预测结果与实验测量值进行比较。

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