Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

摘要

The past few years have seen increasing interest in advanced package architectures as compact, high performance platforms for heterogeneous integration across a wide variety of applications. Interest in advanced packaging is driven by the need for increased on-package bandwidth, the need to integrate diverse IP from multiple foundries and the need for improved yield resiliency . A number of innovative package architectures that enable power-efficient on-package bandwidth interconnects have made major advances in microelectronics performance possible . Focus on heterogeneous integration makes visible to broader audiences, the packaging community that in a quiet, systematic and largely unheralded manner continues to drive momentous changes in packaging, assembly and associated test technologies. In this paper, I will attempt to describe some of these changes and more importantly offer a perspective for how packaging should evolve and what this means to the thermal management community.