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Characterization of silicon in the terahertz

机译:太赫兹硅的特征

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摘要

Semiconductor materials are widely used in integrated circuit and are important material platform in the fabrication and development of different technologies. Their material properties, e.g. complex permittivity and permeability, must be accurately known when designing high frequency microwave and millimeter wave devices. The applications of terahertz (THz) waves is receiving considerable attention because of the many potential applications. In this paper we provide results of an initial study to characterize low resistance silicon. First a free-space measurement setup is used to measure the characteristics of four commercial silicon wafers. These differently doped silicon wafers have different resistivity, i.e. 10, 20, 30 & 40 Ω cm. The complex relative dielectric constant and the loss tangent of the four types of silicon are measured. Second, the absorption properties of the same samples are measured using a compact terahertz time domain spectrometer (THz-TDS). In both measurements the results show that the sample doped using Phosphorus has a higher loss (absorption) and lower permittivity in the THz range compared the three wafers doped with Boron. In the case of the three Boron doped samples the loss tangent was found to depend on the resistivity of the material.
机译:半导体材料广泛用于集成电路,是制造和发展的重要材料平台。它们的材料特性,例如在设计高频微波和毫米波装置时,必须准确地知道复杂介电常数和渗透率。由于许多潜在的应用,Terahertz(Thz)波的应用正在接受相当大的关注。在本文中,我们提供了初步研究的结果,以表征低电阻硅。首先,自由空间测量设置用于测量四个商用硅晶片的特性。这些不同掺杂的硅晶片具有不同的电阻率,即10,20,130Ωcm。测量复杂的相对介电常数和四种类型的硅的损耗正线。其次,使用紧凑的太赫兹时域光谱仪(THZ-TDS)测量相同样品的吸收性能。在两种测量中,结果表明,使用磷掺杂的样品具有更高的损失(吸收),并且在THz范围内降低介电常数,比较掺杂硼的三个晶片。在三个硼掺杂样品的情况下,发现损耗正切取决于材料的电阻率。

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