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ITHz one-sided directional slot antenna on a chip connected with InAs HEMT

机译:与InAs HEMT连接的芯片上的ITHz单面定向缝隙天线

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Terahertz (THz) range holds between infrared light and millimeter wave or microwave radiation. Moreover, THz waves is highly attenuated by the metal object or sensitive to an inter-molecular binding force. Therefore, imaging using THz range is attracted much attention for security, manufacturing, chemical imaging, and so on. In our research, the THz detector composed of Indium arsenide (InAs) high electron mobility transistor (HEMT) and one-sided directional slot antenna on a chip will be developed. In this paper, we focused on the antenna on a chip. The proposed antenna has three layers, namely, top antenna metal, dielectric substrate (BCB. benzocyclobutene) and bottom floating metal layer. There are a coplanar (CPW) feed lines and slots on the top antenna metal. By optimizing the size of the bottom floating metal layer, the radiation toward the back side is suppressed. The CPW feed line is connected the gate electrode on the InAs HEMT. In order to maximize the receiving THz signal form the antenna to InAs HEMT. antenna and gate input impedance is characterized by using the 3D electromagnetic simulator. It has been found that when the input impedance of the gate electrode changes from 10 ohms to 50 ohms, the voltage generated at the gate electrodes is tripled. The antenna was fabricated by the conventional photolithography process. The size of the radiation metal is 290 μm × 210 μm on the top metal with probe pads. The measured antenna gain is 5.57 dBi at 0.93 THz compared with the 5.96 dBi antenna gain at 1 THz from the simulation.
机译:太赫兹(THz)范围介于红外光和毫米波或微波辐射之间。此外,太赫兹波被金属物体高度衰减或对分子间结合力敏感。因此,在安全性,制造,化学成像等方面,使用THz范围的成像备受关注。在我们的研究中,将开发由砷化铟(InAs)高电子迁移率晶体管(HEMT)和芯片上的单向定向缝隙天线组成的THz检测器。在本文中,我们专注于芯片上的天线。所提出的天线具有三层,即顶部天线金属,电介质衬底(BCB。苯并环丁烯)和底部浮动金属层。顶部天线金属上有一条共面(CPW)馈线和插槽。通过优化底部浮动金属层的尺寸,可以抑制向背面的辐射。 CPW馈线连接InAs HEMT上的栅电极。为了使接收的THz信号最大化,将天线连接到InAs HEMT。天线和栅极输入阻抗的特征是使用3D电磁模拟器。已经发现,当栅电极的输入阻抗从10欧姆变为50欧姆时,在栅电极处产生的电压增加了两倍。天线是通过常规光刻工艺制造的。带有探测垫的顶部金属上的辐射金属尺寸为290μm×210μm。根据仿真,在0.93 THz处测得的天线增益为5.57 dBi,而在1 THz处测得的天线增益为5.96 dBi。

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