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Elevating Low-Quality Silicon Wafers For High-Efficiency Silicon Heterojunction Solar Cell Applications

机译:为高效硅异质结太阳能电池应用提升低质量硅晶片

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We present defect-engineering approaches such as gettering and hydrogenation for silicon heterojunction structures. A method to evaluate the impact on the potential implied open circuit voltages of lifetime test structures is discussed. Lifetime analysis is performed on samples with silicon nitride passivation after defect-engineering to determine the injection level dependent bulk lifetime and dark saturation current density components. An implied open circuit voltage is predicted by assuming a dark saturation current density (J0e) appropriate for the silicon heterojunction structure while accounting for the measured bulk lifetime of the material. Agreement within 5 mV is observed for the validation samples. Subsequently, the technique is used to assess the impact of defect engineering on the potential implied open circuit voltage of a range of samples. We show that treated wafers are expected to have improvement in implied open-circuit voltages of from 706 mV to 730 mV for n-type Cz-Si, 625 mV to 723 mV for p-type Cz-Si, from 677 mV to 714 mV for p-type mc-Si, and from 657mV to 692 mV for p-type UMG silicon wafers.
机译:我们提出了缺陷工程方法,例如硅异质结结构的吸杂和氢化。讨论了一种评估对寿命测试结构的潜在隐含开路电压影响的方法。缺陷工程处理后,对具有氮化硅钝化的样品进行寿命分析,以确定取决于注入水平的体寿命和暗饱和电流密度分量。假设暗饱和电流密度(J 0e )适用于硅异质结结构,同时考虑了材料的实测体积寿命。对于验证样品,观察到5 mV以内的一致性。随后,该技术用于评估缺陷工程对一系列样品的潜在隐含开路电压的影响。我们表明,处理过的晶圆有望对n型Cz-Si的隐含开路电压有所改善,从706 mV到730 mV,对于p型Cz-Si的隐含开路电压从677 mV到714 mV有所改善对于p型mc-Si,p型UMG硅晶片的电压范围为657mV至692 mV。

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