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Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System

机译:具有高能效和低延迟通道的高带宽内存(PIM-HBM)架构中的内存中处理功能,适用于高带宽系统

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In this paper, for the first time, we propose a processing-in-memory in high bandwidth memory (PIM-HBM) architecture for high bandwidth systems with low dynamic random-access memory (DRAM) access costs. The main concept of the proposed PIM-HBM architecture is to embed processing units into a logic base of high bandwidth memory (HBM) to decrease the energy consumption and latency of interconnections as the physical length between core and DRAM decreases. To verify the proposed PIM-HBM architecture, we designed on-chip and on-interposer I/O channels using a CMOS 0.18 µm process. We extracted channel parasitic using an electromagnetic (EM) solver and performed a SPICE simulation to compare the system performance of the proposed architecture with the conventional HBM. As a result, the performance of the proposed PIM-HBM architecture is successfully verified by reducing energy consumption and latency of interconnections by 77 % and 79 % compared to the conventional HBM system.
机译:在本文中,我们首次针对具有低动态随机存取存储器(DRAM)访问成本的高带宽系统,提出了高带宽存储器(PIM-HBM)架构中的内存中处理。所提出的PIM-HBM体系结构的主要概念是将处理单元嵌入到高带宽存储器(HBM)的逻辑库中,以随着内核和DRAM之间的物理长度减小而减少互连的能耗和等待时间。为了验证建议的PIM-HBM体系结构,我们使用CMOS 0.18 µm工艺设计了片上和插入式I / O通道。我们使用电磁(EM)求解器提取了寄生的信道,并进行了SPICE仿真,以将建议的体系结构与常规HBM的系统性能进行比较。结果,与传统的HBM系统相比,通过将能耗和互连等待时间减少了77%和79%,成功地验证了所提出的PIM-HBM体系结构的性能。

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