Non-Destructive Characterization of Advanced IC Packages with Buried Features Using 3D X-ray

摘要

Technology development can be constrained by the capabilities of the engineering tools which are available to the teams developing them. Development of leading-edge advanced IC packages can be limited or slowed-down by challenges in characterization of buried interconnect solder structures, which are fundamental to many advanced IC packages. This paper will present a new methodology for characterization of buried features in IC packages.