Microfabricated ISM Band Inductors using MCM-D Technology over Alumina Substrates

摘要

Current trend on electronics seek devices with more functionalities integrated on a smaller footprint. Multi-chip module technology based on thin films deposition (MCM-D) is one enabling technology that can achieve such demand. In this paper authors present a technological sequence to fabricate inductors onto an MCM-D device that can be integrated with other passive components aiming for higher integration compared to PCB technologies and RFID and/or IoT devices. We found Q values for unlicensed ISM (industrial, scientific and medical applications) bands of the fabricated devices present specs similar to commercially available components.