+n-like devices even in'/> Non-linear behavior of Al-contacted pure amorphous boron (PureB) devices at low temperatures
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Non-linear behavior of Al-contacted pure amorphous boron (PureB) devices at low temperatures

机译:铝接触纯非晶硼(PureB)器件在低温下的非线性行为

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Deposition of pure amorphous boron (PureB) layers on n-type Si results in p+n-like devices even in cases where B in-diffusion during the deposition is not expected. It is suspected that such behavior is due to the formation of an interfacial hole layer (IHL) between the PureB and Si. To further investigate physical mechanisms governing conduction of holes across the PureB/Si interface and through the IHL, electrical measurements were performed from room temperature down to cryogenic temperatures as low as 100 K. In this paper, current-voltage (I-V) measurements are made on structures where the PureB connects to p-type Si regions. One set of devices comprises ring-shaped structures designed for measuring the conductance through the IHL. In these structures, the PureB layer is deposited in rings that are contacted at the inner and outer perimeter with Al. Another set of samples includes devices where the PureB layer was deposited on p-type bulk Si. At room temperature, a close to linear change of current with voltage was seen irrespective of the PureB layer thickness and post-deposition processing. Lowering the operating temperature led to an increasingly non-linearI-Vcharacteristics. Plausible explanations for the non-linear behavior are considered and discussed in the paper.
机译:在n型硅上沉积纯非晶硼(PureB)层会导致p + n型器件,即使在沉积过程中B不会扩散的情况下也是如此。怀疑这种行为是由于在PureB和Si之间形成了界面空穴层(IHL)。为了进一步研究控制通过PureB / Si界面以及通过IHL的空穴传导的物理机制,从室温到低至100 K的低温温度都进行了电学测量。 I-V )测量是在PureB连接到p型Si区域的结构上进行的。一组设备包括设计用于测量通过IHL的电导的环形结构。在这些结构中,PureB层沉积在环的内部和外部与Al接触的环中。另一组样品包括其中PureB层沉积在p型块状Si上的器件。在室温下,无论PureB层的厚度和沉积后的处理如何,电流随电压的变化都接近线性变化。降低工作温度导致非线性度越来越高 I-V 特征。本文考虑并讨论了非线性行为的合理解释。

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