Component Displacement and Solder Spreadability Dependence on Manufacturing Conditions

摘要

This paper aims at an examination of the influence of various kinds of surface finishing of printed circuit board metallizations, two different lead-free solders and one lead-containing solder as reference, and two methods of soldering on the spreading behavior. The parameters examined were the solder geometry as a measure for spreading and the displacement of surface mount components. Series of samples were examined using the 3D microscope HAWK QC 5000 and Nikon Instruments Software for Basic Research. This work is intended to facilitate the selection of suitable material combinations to achieve an optimum solder joint quality. Keywords: lead-free soldering, solder wettability, factor analyses