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Temperature dependence of the on-state voltage drop in field-stop IGBTs

机译:场截止IGBT中通态压降的温度依赖性

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Insulated Gate Bipolar Transistor (IGBT) is the reference design for power semiconductor switches in the range of the medium-high power applications. Different designs were proposed along the development story of this device, but the actual trend is leaded by the Field-Stop IGBT (FS-IGBT) concept. One of the main advantages of this design is the great accuracy in defining the Emitter injection efficiency of the vertical PNP. However a careful design of the Collector side has to be carried out to avoid unwanted effects such as a negative temperature coefficient for the Von of the device. In this work we present the two main cause of the aforementioned effect, with a detailed analysis of the effect of the arising of a Schottky Barrier (SB) at the Collector contact for low doping concentrations.
机译:绝缘栅双极晶体管(IGBT)是中高功率应用范围内功率半导体开关的参考设计。沿着该器件的开发过程提出了不同的设计,但实际趋势是由场截止IGBT(FS-IGBT)概念引领的。该设计的主要优点之一是在确定垂直PNP的发射极注入效率方面具有很高的准确性。但是,必须对收集器侧进行仔细的设计,以避免产生不良影响,例如器件Von的负温度系数。在这项工作中,我们介绍了产生上述效应的两个主要原因,并详细分析了低掺杂浓度下在集电极接触处出现肖特基势垒(SB)的影响。

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