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The Corrosion Behavior of Au/Al Interface under High Accelerated Stress Test

机译:高加速应力试验下Au / Al界面的腐蚀行为

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Different cure time has significantly impact on the Au/Al interface corrosion behavior during high accelerated stress test (HAST). A detailed IMC evolution of Au/Al wire bonding interface during HAST is discussed in this paper. After 96hrs/144hrs 130 °C and 85%RH HAST, wire pull ball lift fail rate decreased with the increase of cure time. IMC phase at Au/Al interface were characterized by focus ion beam(FIB)/transmission electron microscope(TEM), and three types of Au-Al IMC phases were observed at the Au/Al interface. Longer cure time is favorable to increase the thickness of Au8Al3 phase, which is better to resist corrosion and strengthen interface bonding. Au/Al interface failure mechanism is discussed in this paper.
机译:在高加速应力测试(HAST)期间,不同的固化时间会对Au / Al界面腐蚀行为产生重大影响。本文讨论了HAST期间金/铝引线键合界面的详细IMC演变。在130°C和85 \%RH HAST的96hrs / 144hrs之后,拉丝球提升失败率随固化时间的增加而降低。用聚焦离子束(FIB)/透射电子显微镜(TEM)表征了Au / Al界面的IMC相,并在Au / Al界面观察到了三种类型的Au-Al IMC相。更长的固化时间有利于增加Au8Al3相的厚度,更好地抵抗腐蚀并加强界面键合。本文讨论了金/铝界面失效机理。

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