Study on the Reliability of Large Size LCCC

摘要

Leadless Ceramic Chip Carrier (LCCC) devices are widely used in the field of aerospace due to the characteristics of miniaturization, high density and good heat dissipation. However, the big mismatch of the Coefficient of Thermal Expansion (CTE) between LCCC and PCB (FR-4) will cause the creep-fatigue damage of solder joints and lead the further failure of product during high-low temperature service environment. The theoretical calculation analysis indicates that increased height between LCCC and PCB can improve the reliability of solder joints significantly. Basing on this result, a LCCC reballing method was proposed, which could reduce the average failure rate of devices significantly.