Research of inkjet printing process for flexible electronic interconnect structures

摘要

Inkjet printing is known as a main technology to manufacture flexible electronic interconnect structures due to its ability to print different types of inks on flexible substrate in a controllable and fast way. However, current inkjet printing processes on manufacturing flexible electronic interconnects still face many challenges (e.g. fracture, rough etc.). In view these serious problems, the following research has been carried out in this paper. First of all, printed a series of single ink drop array on the flexible substrate, and measured its average diameter to select the appropriate distance spacing. Second, manufactured flexible interconnect structures with different substrate-ink groups by inkjet printing. Third, made a compare on the effect with different pre-treatment of the flexible substrate. And finally, discussed the effect on surface topography and resistivity of interconnect structures with different layers, curing temperature and time. After all above experiments, we obtained flexible interconnects with uniform surface morphology and good electrical conductivity.