Measurement of Dynamic Junction Temperature for LED Flash Units of Camera

摘要

This paper presents dynamic thermal analyses of LEDs for the flash unit of a camera driven by current pulses. A new approach with the modified T3ster has been successfully developed to extend the time-resolved measuring with a constant driving current based on the JESD51 to dynamic junction temperature with pulsed current. For comparison, CAD simulation using Flotherm was performed. Good agreement between experimental measurement and computational modelling was achieved.