首页> 外文会议>European Microwave Integrated Circuits Conference >A Novel TCAD Approach to Temperature Dependent DC FinFET Variability Analysis
【24h】

A Novel TCAD Approach to Temperature Dependent DC FinFET Variability Analysis

机译:基于温度的直流FinFET变异性分析的新型TCAD方法

获取原文

摘要

This paper presents a new approach to extract the temperature-dependent sensitivity of electron devices DC current through efficient, yet accurate, physics-based analysis. The novel technique is based on a Green's function approach, where the response of the device to lattice (ambient) temperature variations is recovered by means of the linearization of the device equations around the nominal device working point and temperature. The same Green's Functions are also used for other device variability analyses, e.g. random doping fluctuations or geometrical variations. A linear superposition of the device response to temperature variations with any other parameter variation, allows for a temperature-dependent device variability analysis, with virtually the same numerical burden as the fixed temperature one. In this paper we verify the technique against non-linearized (MonteCarlo) analyses. A metal gate FinFET is considered in two case studies: temperature-dependent deterministic variations of the fin doping concentration; temperature-dependent random workfunction variations due to metal granularity. The approach is extremely accurate up to 80 K above ambient temperature with a huge reduction in simulation time with respect to MonteCarlo approach.
机译:本文提出了一种新的方法,该方法可通过有效但准确的基于物理的分析来提取电子设备直流电流的温度相关灵敏度。这项新技术基于格林函数方法,在该方法中,器件对晶格(环境)温度变化的响应通过器件方程在标称器件工作点和温度附近的线性化得以恢复。相同的格林函数还用于其他设备可变性分析,例如随机的掺杂波动或几何变化。器件对温度变化以及其他任何参数变化的线性叠加,可以进行与温度相关的器件变异性分析,其数值负担实际上与固定温度相同。在本文中,我们针对非线性(MonteCarlo)分析验证了该技术。在两个案例研究中考虑了金属栅极FinFET:鳍片掺杂浓度的温度相关确定性变化;金属粒度导致温度依赖的随机功函数变化。与蒙特卡洛方法相比,该方法在环境温度以上高达80 K时极其精确,并且大大减少了仿真时间。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号