Design and Technology Co-Optimization for exploring Power, Performance, Area and Manufacturability Trade-offs in Advanced FDSOI and FinFET Technologies

摘要

Advanced Technology Development requires detailed and extensive Design and Technology Co-optimization (DTCO), from device to design to application, to balance system-dependent Power, Performance and Area (PPA) with manufacturability of the technology for steep yield ramp in production. The multi-dimensional exploration and trade-off analysis requires deeper understanding of the process, lithography, device, digital, analog and memory design constraints, as well as application- and system-level implications at a very early stage of technology development. In this paper, we will present the top challenges, mitigation and trade-offs needed to realize an optimized solution in both FDSOI and FinFET Technologies.