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A 28 GHz four-channel phased-array transceiver in 65-nm CMOS technology for 5G applications

机译:适用于5G应用的采用65 nm CMOS技术的28 GHz四通道相控阵收发器

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A Fully integrated 4-element symmetrical TX/RX RF integrated circuit for 26-30 GHz 5G beam-forming system is implemented in 65-nm CMOS technology. Each array element is digitally controlled with 5.625° step and 2 dB gain step. The system employs a heterodyne architecture with 6 GHz intermediate frequency (IF). The up-conversion and down-conversion mixers are integrated on the same chip with a shared LO driver chain. The phased-array power combining/splitting is done using Wilkinson combiner/divider. The RFIC features 3.4 to 3.9 dB noise figure and -5 to -3.5 dBm IIP3 in RX mode, 18 dB maximum power gain and OP1dB of 14.7 dBm per chain in TX mode. The maximum root mean square amplitude and phase error of each array element is 0.25 dB and 1.5°, respectively. The RFIC area is 18 mm2including pads and it consumes 240 mW per TX chain, 120 mW per RX chain and 174 mW for the LO amplifier with total power of 1.58 W from a 1.2 V supply.
机译:在65nm CMOS技术中实现了用于26-30 GHz 5G波束形成系统的全集成4元素对称TX / RX RF集成电路。每个阵列元件均以5.625°步进和2 dB增益步进进行数字控制。该系统采用具有6 GHz中频(IF)的外差架构。上变频和下变频混频器通过共享的LO驱动器链集成在同一芯片上。相控阵功率合并/分离是使用Wilkinson合并器/除法器完成的。 RFIC在RX模式下具有3.4至3.9 dB的噪声系数和-5至-3.5 dBm IIP3,在TX模式下具有18 dB的最大功率增益和每条链14.7 dBm的OP1dB。每个阵列元件的最大均方根振幅和相位误差分别为0.25 dB和1.5°。 RFIC区域为18毫米 2 包括焊盘,每个TX链消耗240 mW,每个RX链消耗120 mW,LO放大器消耗174 mW,1.2 V电源的总功率为1.58W。

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