Spring-lattice model for fast, flexible and easy strain prediction in semiconductor devices ET/ID: Enabling technologies and innovative devices

摘要

A simple 2D spring-lattice model is described, which is able to predict the amount of strain and its distribution in modern semiconductor devices. The model allows arbitrary structures to be constructed in a matter of minutes, and returns the strain distribution at the nano-meter scale. The framework allows straight-forward extension towards 3D modeling.