Thermal peak management using organic phase change materials for latent heat storage in electronic applications

摘要

The inside of modern high power electronics consist of a large amount of integrated circuits for switching and supply applications. This technology has aside the benefits the problem of more and more increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used as a thermal sink to reduce the on chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic devices on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The aim of the idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which could damage or destroy the device by using a phase change material to buffer the energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jig approaches.