3D-printed mold electroforming for microfabrication of W-band TWT circuits

摘要

We demonstrate a method for fabricating upper millimeter-wave TWT circuits and passive components, based on additive manufacturing and copper electroforming. The method allows the creation of a solid copper circuit, suitable for high-power vacuum electronic devices, beginning with a plastic inverse mold built on a commercial 3D printer. We present progress on W-band serpentine waveguide circuits fabricated in copper by this 3D-printed mold electroforming (3D-PriME) process.