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Performance comparison of different SiC-MOSFETs for high-frequency high-power DC-DC converters

机译:高频大功率DC-DC转换器的不同SiC-MOSFET的性能比较

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Wide-band-gap (WBG) semiconductor devices represent an opportunity for reaching higher power densities for power electronic converters due to higher switching speeds, and thus, a size reduction of the passive components is enabled while the total efficiency of the converter is not compromised. In this paper, four SiC-MOSFETs from CREE/Wolfspeed are compared regarding their losses and performance in an application with a high-frequency DC-DC converter. For this purpose, the on-state resistances and body-diode voltage drops of every MOSFET are measured for different drain currents to evaluate the semiconductors static losses. The switching loss of every MOSFET is obtained with a double-pulse test. Three of these MOSFETs are further evaluated in a two-phase interleaved DC-DC converter prototype to investigate the system efficiency. In the end, device C2M0040120D shows the highest potential for high-power high-frequency operation, due to a balance between electrical and thermal properties.
机译:由于更高的开关速度,宽带隙(WBG)半导体器件为功率电子转换器提供了达到更高功率密度的机会,因此,在不影响转换器总效率的前提下,可以减小无源组件的尺寸。在本文中,比较了来自CREE / Wolfspeed的四种SiC-MOSFET的损耗和在高频DC-DC转换器应用中的性能。为此,针对不同的漏极电流测量每个MOSFET的导通电阻和体二极管压降,以评估半导体的静态损耗。每个MOSFET的开关损耗都是通过双脉冲测试获得的。在两相交错式DC-DC转换器原型中进一步评估了这些MOSFET中的三个,以研究系统效率。最后,由于电性能和热性能之间的平衡,设备C2M0040120D在高功率高频操作中显示出最高的潜力。

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