Silicon-Based Target Materials for Large-Area Sputtering Applications

摘要

Si:Al and Si:TiO_x targets with a wide alloy range were reac-tively sputtered. The sputtering behavior is analyzed with respect to the content of Al and TiO_x Cathode voltage, reactive gas flow, dynamic deposition rate, and hysteresis curves are also compared. In addition, the influence of the deposited alloy on the refractive index and on wear behavior is briefly discussed.