Technological study to obtain thick conductors for power electronics by screen and stencil printing

摘要

This paper deals with the implementation of thick film structures using screen and stencil printing for power electronics. The structures were realised with a sequential and a modified screen printing process and a polyimide stencil which are described in this paper. Using a sacrificial tape as a temporary stencil to obtain thicker conductors is investigated. All structures are compared in height, width and flatness of their surface. An X-ray inspection is performed to check the structures related to voids and edge quality. A silver paste from DuPont printed on alumina is used for all tests in this paper.