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Bayesian Analysis for OPC Modeling with Film Stack Properties and Posterior Predictive Checking

机译:具有薄膜叠层特性和后验预测的OPC建模的贝叶斯分析

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The use of optical proximity correction (OPC) demands increasingly accurate models of the photolithographic process. Model building and analysis techniques in the data science community have seen great strides in the past two decades which make better use of available information. This paper expands upon Bayesian analysis methods for parameter selection in lithographic models by increasing the parameter set and employing posterior predictive checks. Work continues with a Markov chain Monte Carlo (MCMC) search algorithm to generate posterior distributions of parameters. Models now include wafer film stack refractive indices, n & k, as parameters, recognizing the uncertainties associated with these values. Posterior predictive checks are employed as a method to validate parameter vectors discovered by the analysis, akin to cross validation.
机译:光学邻近校正(OPC)的使用要求光刻工艺的模型越来越精确。在过去的二十年中,数据科学界的模型构建和分析技术取得了长足的进步,它们可以更好地利用可用信息。本文通过增加参数集并采用后验预测,扩展了用于光刻模型参数选择的贝叶斯分析方法。继续进行马尔可夫链蒙特卡洛(MCMC)搜索算法以生成参数的后验分布。现在,模型可以识别晶片薄膜叠层的折射率n&k作为参数,从而可以识别与这些值相关的不确定性。后验预测检查被用作验证通过分析发现的参数向量的方法,类似于交叉验证。

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