Influence of low temperature on tensile properties and fracture behavior of Sn3Ag0.5Cu solder alloy

摘要

The tensile response and fracture surface of the lead-free Sn3Ag0.5Cu solder alloys were investigated at the strain rates of 0.001 s-1 over the temperature range from -150°C to 20 °C. The ultimate tensile strength and yield strength of Sn3Ag0.5Cu increased almost linearly with decreasing temperature. The fracture behavior of Sn3Ag0.5Cu varied from ductile to brittle as the ambient temperature decreased to -150°C, which could be attributed to the asymmetric tetragonal structure of β-Sn which is the main constituent of Sn3Ag0.5Cu solder alloy.