首页> 外文会议>IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems >Color Shift Analysis and Modeling of High Power Warm White pc-LED under High Temperature and High Humidity Environment
【24h】

Color Shift Analysis and Modeling of High Power Warm White pc-LED under High Temperature and High Humidity Environment

机译:高温高湿度环境下大功率暖白PC-LED的色移分析与建模

获取原文

摘要

This paper focuses on the color stability degradation analysis and modeling for the commercially available high power warm white phosphor converted LED (pc-LED) packages under both high temperature and high humidity conditions. During the experiment, 3 kinds of different high power pc-LEDs were subjected to both high temperature, and high relative humidity (85°C/85%RH, 75°C/75%RH, 65°C/90%RH) accelerated life test with a 350mA bias current. Experimental results show that the phosphor binder layer of the pc-LEDs can swell and the color stability of LEDs degrades significantly. High temperature and humidity will oxidize the phosphor particles and oxidized phosphor particles shift the phosphor emission spectrum to the lower energy wavelength. The redistribution and oxidation of phosphor particles inside the phosphor binder will cause dramatically degradation of colorimetric properties of LED package in a very short time. Also, a closed form color shift model is built to project the color shift distance forward and prognosticate the color stability of LED packages. In the proposed model, not only temperature and humidity are included, but also the package characteristics, such as phosphor particles diameter, phosphor binder thickness. Compared with the experimental data, it is found that the color shift model can predict the color shift distance of the LED packages in an acceptable range.
机译:本文侧重于在高温和高湿度条件下进行市售高功率暖白磷转换LED(PC-LED)封装的颜色稳定性劣化分析和建模。在实验过程中,3种不同的高功率PC-LED经过高温,高相对湿度(85℃/ 85%RH,75℃/ 75%RH,65℃/ 90%RH)加速使用350mA偏置电流的终身测试。实验结果表明,PC-LED的荧光体粘合剂层可以膨胀,LED的颜色稳定性显着降低。高温和湿度会氧化磷光体颗粒,并氧化磷光体颗粒将磷光体发射光谱移位到较低的能量波长。磷光体粘合剂内的磷光体颗粒的再分配和氧化将在很短的时间内引起LED封装的比色性能。此外,建立了闭合形式的颜色移位模型,以将转向距离向前投影并预后LED封装的颜色稳定性。在所提出的模型中,不仅包括温度和湿度,还包括封装特性,例如磷光体颗粒直径,磷粘合剂厚度。与实验数据相比,发现颜色移位模型可以预测LED封装在可接受的范围内的颜色偏移距离。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号