Silicon Chip Removal Technique Using Wet Etching Process for Failure Analysis on Multi-Chip Packages (MCP)

摘要

The work presented here shows the alternative silicon chip removal technique using wet etching process. The effect of various chemical solution and temperature on bulk silicon etching is demonstrated. The etch rate plotted shows NaOH provide the best etch rate compare to other experimented chemical solutions. However, idealized silicon removal technique using wet etching process will need further process development to make it ultimately effective for thin die MCP i.e. a packaging technology with die thickness less than 100um