Analytical model of stress distribution of solder strip of crystalline silicon cells under temperature field

摘要

The aim of this paper is to analysis of distribution of shear stress of ribbon on the solar cell under temperature field. A new thermal stress analytical model of two-layer bonded structure based on physical mechanical law is established to calculate the distribution of shear stress. Through a series of calculation, the function of the distribution of shear stress can be obtained. Some meaningful conclusions which agree with practical production can be summarized as follows: shear stress is focused on the edges and, with the increase of temperature difference, the value of shear stress in the edge is more and more big.